The size of the USB3.0 interface USB3.0 connector USBAF short body mother seat direct insertion flanging. Our company's clamp type USB3.0 mother seat AF model has been officially mass-produced, and we have made targeted improvements to address the issues previously reported by customers. Generally speaking, when processing the USB mother seat 3.0 clamp type, we often encounter problems such as small pin spacing or 9P pin flatness, which prevent PCB circuit boards from completing the clamp operation quickly at once, If there is a bending of the pin during this process, the production line personnel must repair the product, which greatly reduces the production efficiency. For the USB3.0 mother seat clamp 0.8 model, the situation is even worse. For this reason, our Structural engineering personnel have made corresponding improvements to the shape of the splint pin. In order to make the PCB better and faster to complete the splinting operation, our company has bent the tail double row pins to make K pins, and designed a guide opening (with a guide opening) at the opening of the splint, so that the production line personnel can complete the corresponding workflow more quickly. The specific effect is shown in the above figure (the first and last two images are 1.0 and 0.8 models respectively). The USB3.0 mother seat is an improved version of the USB2.0 specification, and the industry generally believes that it is only an improved version of the USB2.0 mother seat, unlike the current USB3.1 mother seat TYPE-C connector, which is widely recognized as a new generation connector. The traditional USB3.0 mother seat is made of blue rubber core, and our company's USB3.0 mother seat clamp type is no exception. However, due to our company's use of environmentally friendly and high-temperature resistant LCP plastic, from the naked eye, the color of the rubber core of this USB3.0 mother seat clamp type is not as bright as the plug-in DIP USB3.0 mother seat connector. In terms of contact terminals, the USB3.0 mother seat is a double row 9-pin, 5-4 arrangement, the internal contact part is gold plated, and the clamp section is tin plated. From the current perspective, The main application areas of the USB3.0 motherboard are computers and peripheral devices of mobile phones in the electronic consumer goods market, such as adapters and USB-HUB connectors. However, through sample delivery and shipment records, we have found that more and more customers are using it in ultra-thin devices and digital products. Thanks to its sandwich packaging specifications, this USB3.0 motherboard motherboard motherboard can even achieve a better space occupation ratio than conventional sunken and broken connectors, It is the best choice for USB3.0 mother seat interface on ultra-thin devices, but at the same time, there are advantages and disadvantages. Choosing this USB3.0 mother seat clamp type requires structural solidification and stability treatment. Generally, customers use an external structure with internal buckles to fix the USB3.0 mother seat interface. This idea can be used as a reference for customers who need it. Our company has officially produced and shipped it in mass production, If you need relevant samples, you can directly contact our company!