Shenzhen Guangjiayuan Electronic Technology Co., Ltd
Mr. Chen: 136-6225-2835 (same WeChat account)
QQ: 979285705
Miss Chen: 189-2385-0895 (same WeChat account)
QQ: 2391552662
Chen Weiting :135-3824-4786 (same WeChat account)
Chen Weihao: 139-2459-4393 (same WeChat account)
Tel: 86-0755-33182327
Email: gjydz88@163.com
Website: www.usb-type.com
Address: Building 10, Hongxing Gebu Qixiang, Songgang Town, Bao'an District, Shenzhen, Guangdong Province
First step of installation
The power supply current supported by mini 2.0 can reach 500mA, which can slowly charge the battery. Due to its small size, the mini USB base is generally difficult to operate when installed on welding. The key is that if the distance between the welding pins is too close, it is easy to cause the pins to weld together. Therefore, at the beginning of welding, attention should be paid to removing debris and impurities from the surface of each solder joint pin of the USB base, otherwise it will not affect the unstable welding.
Installation Step 2
After removing impurities, apply the solder joint pins to the soldering flux of the mini USB base, taking care not to stick too much soldering flux, otherwise it will be difficult to wipe off in the future. If you want to make the mini USB base fixed less prone to displacement and smoother welding, then you need flux.
Installation Step 3
Secondly, after applying flux, the tin on each solder joint should be cleaned with a soldering iron. Its purpose is to prevent excessive tin and prevent the USB base from causing false soldering, leaving only a small amount of tin on the surface of the solder joint of the pin.
Installation Step 4
Then simply place the USB base on the solder pad, gently place it in the alignment line position, and gently press the pins with a soldering iron. After a few seconds, the solder can be welded.
Precautions:
1. During the welding process of the mini USB motherboard, please note that the soldering iron temperature should not be too high or too low. Otherwise, excessive temperature can easily lead to the soldering of pins on the USB motherboard, and too low temperature can also lead to unstable soldering of the USB motherboard.
Secondly, during the welding process of the USB base, be careful not to operate with excessive strength to avoid bending the USB base pins under stress.
After the mini USB base is welded, it is prohibited to shake or vibrate before each pin solder joint is completely solidified, otherwise it is easy to disconnect the pin solder joint.
4. The mini base should not be used in high temperature environments for a long time, because when the working temperature is too high, it can cause the electrical load of the base to exceed the limit, which can lead to the risk of fire and short circuit in the socket. So when using a USB socket for a long time, it is generally necessary to stop the device and rest until the working temperature has dissipated heat before continuing to use the USB socket, which can avoid and reduce the occurrence of faults.
5. Be careful not to let some small debris invade the interface, otherwise it can easily affect the poor contact between the mini base and the mini plug, resulting in some situations where the induction cannot be recognized. Moreover, the mini socket has been used for a long time, so it is important to pay attention to the daily dust cleaning of the interface to avoid excessive dust that can easily cause rust on the components of the socket interface, thus affecting the performance of the mini socket.
Contact person:
Mr. Chen 136-6225-2835 (same WeChat account)
Miss Chen 189-2385-0895 (same WeChat account)
Chen Weiting 135-3824-4786 (same WeChat account)
Chen Weihao 139-2459-4393 (same WeChat account)
Address:
Building 10, Hongxing Gebu Qixiang, Songgang Town, Bao'an District, Shenzhen, Guangdong Province
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